John M Wilson
机构: NVIDIA Circuits Research Group
每年引用次数
引用次数
引用: 3,606
H-指数: 28
I10-指数 : 57
出版物: 112
A 4.3GB/s mobile memory interface with power-efficient bandwidth scaling
Li , Nguyen , Bucher , Leibowitz
symposium on vlsi circuits 136 -137
135
2009
Method and apparatus for source-synchronous signaling
Brian S. Leibowitz , Wayne D. Dettloff , Jared L. Zerbe , Barry William Daly
61
2014
Active crosstalk cancellation for next-generation single-ended memory interfaces
John Wilson , Dan Oh
electronic components and technology conference 202 -208
9
2011
Co-design and optimization of a 256-GB/s 3D IC package with a controller and stacked DRAM
David Secker , Mandy Ji , John Wilson , Scott Best
electronic components and technology conference 857 -864
7
2012
Driver pre-emphasis techniques for on-chip global buses
Liang Zhang , John Wilson , Rizwan Bashirullah , Lei Luo
international symposium on low power electronics and design 186 -191
20
2005
Simplified delay design guidelines for on-chip global interconnects
Liang Zhang , Wentai Liu , Rizwan Bashirullah , John Wilson
Proceedins of the 14th ACM Great Lakes symposium on VLSI - GLSVLSI '04 29 -32
1
2004
A 2-to-20 GHz Multi-Phase Clock Generator with Phase Interpolators Using Injection-Locked Oscillation Buffers for High-Speed IOs in 16nm FinFET
Sanquan Song , John Poulton , Xi Chen , Brian Zimmer
custom integrated circuits conference 1 -4
2019
A switching linear regulator based on a fast-self-clocked comparator with very low probability of meta-stability and a parallel analog ripple control module
Sudhir S. Kudva , Sanquan Song , John Poulton , John Wilson
custom integrated circuits conference 1 -4
13
2018
Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications
Paul Franzon , John Wilson , Ming Li
ieee international d systems integration conference 1 -4
2
2010
Fine-grained DRAM: energy-efficient DRAM for extreme bandwidth systems
Mike O'Connor , Niladrish Chatterjee , Donghyuk Lee , John Wilson
international symposium on microarchitecture 41 -54
144
2017
Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors
Evan Erickson , John Wilson , Karthik Chandrasekar , Paul D. Franzon
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems 121 -124
2009
Challenges and solutions for next generation main memory systems
Joong-Ho Kim , Dan Oh , Ravi Kollipara , John Wilson
2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems 93 -96
10
2009
A zero power consumption Multi-Capacitor structure for voltage summing in high-speed FFE
Bruce Su , W. Shepherd Pitts , Paul D. Franzon , John Wilson
19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems 13 -16
1
2010
A 36Gb/s ACCI Multi-Channel Bus using a Fully Differential Pulse Receiver
Lei Luo , John Wilson , Stephen Mick , Jian Xu
custom integrated circuits conference 773 -776
14
2006
A 32Gb/s On-chip Bus with Driver Pre-emphasis Signaling
Liang Zhang , John Wilson , Rizwan Bashirullah , Lei Luo
custom integrated circuits conference 265 -268
31
2006
Power-efficient I/O design considerations for high-bandwidth applications
John C. Eble , Scott Best , Brian Leibowitz , Lei Luo
custom integrated circuits conference 1 -8
2
2011
Fine Pitch Inductively Coupled Connectors for Multi-Gbps Pulse Signaling
Karthik Chandrasekar , John Wilson , Evan Erickson , Zhiping Feng
electrical performance of electronic packaging 11 -14
3
2006
Performance Impact of Simultaneous Switching Output Noise on Graphic Memory Systems
Joong-Ho Kim , Woopoung Kim , Dan Oh , Ralf Schmitt
electrical performance of electronic packaging 197 -200
23
2007
Pseudo-differential signaling scheme based on 4b/6b multiwire code
Dan Oh , Fred Ware , WooPoung Kim , Joong-Ho Kim
electrical performance of electronic packaging 29 -32
7
2008
High Frequency, High Density Interconnect Using AC Coupling
Paul Franzon , Angus Kingon , Stephen Mick , John Wilson
MRS Proceedings 783 ( 1) 611 -615
2003