Effect of micro-texture of electroplated copper thin-films on their mechanical and electrical reliability
Naokazu Murata , Kinji Tamakawa , Ken Suzuki , Hideo Miura
international microsystems, packaging, assembly and circuits technology conference 436 -439
1
2009
Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures
Kohta Nakahira , Yuki Sato , Hiroki Kishi , Ken Suzuki
international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems 1 -6
1
2010
Degradation of reliability of high-k gate dielectrics caused by point defects and residual stress
Hideo Miura , Ken Suzuki , Toru Ikoma , Seiji Samukawa
international reliability physics symposium 713 -714
2
2008
Effect of interface characteristics of W/HfO 2±x on electronic reliability: Quantum chemical molecular dynamics study
Ken Suzuki , Tatsuya Inoue , Hideo Miura
international conference on simulation of semiconductor processes and devices 357 -360
2
2008
Computational chemistry study of accelerated oxidation mechanism of IGSCC of structural materials in LWR environments and theoretical design of SCC resistant alloys
Zhanpeng Lu , Tetsuo Shoji , Ken Suzuki , Yo Ichi Takeda
Proceedings of the 2004 International Congress on Advances in Nuclear Power Plants, ICAPP'04 1937 -1941
2004
A quantum chemical molecular dynamics study of the strain effect on oxygen diffusion in fcc Fe (111) and Fe-Cr (111) surfaces at 288°C
Tetsuo Shoji , Ken Suzuki , Yoichi Takeda , Nishith Kumar Das
12th International Conference on Fracture 2009, ICF-12 8 6061 -6068
2009
Multiscale modeling approach to stress corrosion cracking
Ismail Tirtom , Nishith Kumar Das , Ken Suzuki , Kazuhiro Ogawa
International Conference on Advances in Nuclear Power Plants, ICAPP 2008 2081 -2089
2
2008
Molecular dynamics analysis of the acceleration of intergranular cracking of Ni-base superalloy caused by accumulation of vacancies and dislocations around grain boundaries
Ken Suzuki , Ryo Kikuchi , Shujiro Suzuki
ASME 2020 International Mechanical Engineering Congress and Exposition, IMECE 2020
2020
Theoretical Study of Heterojunction-Like Electronic Properties Between a Semiconductive Graphene Nanoribbon and a Metallic Graphene for Highly Sensitive Strain Sensors
Ken Suzuki , Qinqiang Zhang , Xiangyu Qiao , Masasuke Kobayashi
ASME 2020 International Mechanical Engineering Congress and Exposition
2020
Non-destructive evaluation of the degradation of NI-base superalloy in the air by reflectance spectrum analysis
Ken Suzuki , Hideo Miura , Shin Kasama
ASME 2020 International Mechanical Engineering Congress and Exposition, IMECE 2020
2020
Crystallinity dependence of grain and grain boundary strength of a bicrystal structure of copper
Ken Suzuki , Yiqing Fan , Yifan Luo
ASME 2020 International Mechanical Engineering Congress and Exposition, IMECE 2020
2020
Development of a strain-controlled graphene-based highly sensitive gas sensor
Ken Suzuki , Qinqiang Zhang , Xiangyu Qiao
ASME 2020 International Mechanical Engineering Congress and Exposition, IMECE 2020 2020
2020
Interaction between SiO2 surface and Au clusters studied by computational chemistry
Akira Endou , Seiichi Takami , Kenji Yajima , Ken Suzuki
Kagaku Kogaku Ronbunshu 26 ( 6)
2000
Atomic scale degradation of the initial strengthened micro texture of heat-resistant alloys under creep and fatigue loadings
Ken Suzuki , Hideo Miura , Takuya Murakoshi , Taichi Shinozaki
14th International Conference on Fracture, ICF 2017 409 -411
2017
Quantum chemical molecular dynamics study of oxidation process on Fe-Cr alloy surfaces in high temperature water
Ken Suzuki , Hideo Miura
Nanotechnology 2012: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2012 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2012 641 -644
2012
Improvement of the crystallinity of electroplated copper thin films for highly reliable 3D interconnections
Chuanhong Fan , Osamu Asai , Ryosuke Furuya , Ken Suzuki
electronic components and technology conference 1885 -1890
1
2014
Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections
Naokazu Murata , Naoki Saito , Fumiaki Endo , Kinji Tamakawa
electronic components and technology conference 2119 -2125
7
2011
Evaluation of the crystallinity of grain boundaries of electronic copper thin films for highly reliable interconnections
Naoki Saito , Naoakzu Murata , Kinji Tamakawa , Ken Suzuki
electronic components and technology conference 1153 -1158
8
2012
Improvement of the reliability of TSV interconnections by controlling the crystallinity of electroplated copper thin films
Ryosuke Furuya , Chuanhong Fan , Osamu Asai , Ken Suzuki
electronic components and technology conference 635 -640
5
2013
First-principles study on the dilute Si in bcc Fe: Electronic and elastic properties up to 12.5at.%Si
Arkapol Saengdeejing , Ying Chen , Ken Suzuki , Hideo Miura
Computational Materials Science 70 100 -106
22
2013