引用次数
引用: 5,604
H-指数: 38
I10-指数 : 107
出版物: 258
Economic analysis of test and known good die for multichip assemblies
C.F. MURPHY , M. S. ABADIR , P. A. SANDBORN
Proceedings of 3rd International Workshop on the Economics of Design, Test and Manufacturing 107
3
1994
Development of a maintenance option model to optimize offshore wind farm O\&M
Xin Lei , PA Sandborn , Roozbeh Bakhshi , Amir Kashani-Pour
EWEA OFFSHORE 10 -12
5
2015
Guaranteeing high availability of wind turbines
G Haddad , PA Sandborn , T Jazouli , MG Pecht
Proceedings of the European Safety and Reliability Conference (ESREL)
9
2011
Multichip Module
PA Sandborn , M Abadir
Multichip Module Design, Fabrication, and Testing 21 -21
1995
A design and model building tool for the analysis of switching noise in multichip modules
PA Sandborn
ISHM'90 Proc. 652 -657
8
1990
A New Technique for Including Overshoot Phenomena in Conventional Drift-Diffusion Simulators PA Blakey Motorola APRDL, MD: K-10, 3501 Ed Bluestein Blvd., Austin, TX 78762
XL Wang , CM Maziar , PA Sandborn
Computational Electronics: Semiconductor Transport and Device Simulation 113 51 -51
1990
Annual Index, Volume 11
Einar J Aas , Tore Steen , Karl Klingsheim , Magdy S Abadir
A Direct Method for Determining Design and Support Parameters to Meet an Availability Requirement - Parameters Affecting Both Downtime and Uptime
P. Sandborn , T. Jazouli , A. Kashani-Pour
International journal of performability engineering 10 ( 6) 649
6
2014
The need for aggregated indicators in performance asset management
P. Sandborn , D. Galar , L. Berges , U. Kumar
Eksploatacja I Niezawodnosc-maintenance and Reliability 16 ( 1) 120 -127
9
2014
A Direct Method for Determining Design and Support Parameters to Meet an Availability Requirement
P. Sandborn , T. Jazouli , A. Kashani-Pour
International journal of performability engineering 10 ( 2) 211
11
2014
A new test/diagnosis/rework model for use in technical cost modeling of electronic systems assembly
T. Trichy , P. Sandborn , R. Raghavan , S. Sahasrabudhe
international test conference 1108 -1117
17
2001
Optimization of test/diagnosis/rework location(s) and characteristics in electronic systems assembly using real-coded genetic algorithms
Zhen Shi , P. Sandborn
international test conference 1 937 -946
2
2003
Life Cycle Cost Impact of Using Prognostic Health Management (PHM) for Helicopter Avionics
E. Scanff , K.L. Feldman , S. Ghelam , P. Sandborn
Microelectronics Reliability 47 ( 12) 1857 -1864
119
2007
Assessing the operating reliability of land grid array elastomer sockets
Jingsong Xie , C. Hillman , P. Sandborn , M.G. Pecht
IEEE Transactions on Components and Packaging Technologies 23 ( 1) 171 -176
18
2000
Packaging of a MEMS based safety and arming device
M. Deeds , P. Sandborn , R. Swaminathan
intersociety conference on thermal and thermomechanical phenomena in electronic systems 1 107 -112
11
2000
Test and evaluation of chip-to-chip attachment of MEMS devices
P. Sandborn , R. Swaminathan , G. Subramanian , M. Deeds
intersociety conference on thermal and thermomechanical phenomena in electronic systems 1 133 -140
1
2000
Development of an Obsolescence Cost Model for Nuclear Power Plants
R. England , R. Hale , P. Hunton , M. Muhlheim
Transactions of the American Nuclear Society - Volume 121 121 ( 1) 493 -496
2019
Impact of packaging technology on system partitioning: a case study
P. Dehkordi , K. Ramamurthi , D. Bouldin , H. Davidson
ieee multi chip module conference 144 -149
18
1995
Forecasting technology insertion concurrent with design refresh planning for COTS-based electronic systems
P. Singh , P. Sandborn
reliability and maintainability symposium 349 -354
7
2005
A decision support model for determining the applicability of prognostic health management (PHM) approaches to electronic systems
P. Sandborn
reliability and maintainability symposium 422 -427
24
2005