Modeling, Design and Demonstration of a Single, Innovative Metallurgical System for Socketable and Surface-Mountable Board-Level Interconnections
Omkar Deepak Gupte
Georgia Institute of Technology
3
2021
Functionalization Of Poly (Ether Sulfone) (PES) And Polysulfone (PSf) Membrane
Vivek Subramanian , Omkar Gupte
Bombay Technologist 64 ( 1)
1
2014
Solder paste wicking in socketable BGAs
Omkar Gupte , Vanessa Smet , Gregorio Murtagian , Rao Tummala
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019 000429 -000452
2019
Innovative Socketable and Surface-Mountable BGA Interconnections
Omkar Gupte , Kristie Teoh , Rao Tummala , Gregorio Murtagian
electronic components and technology conference 1028 -1034
4
2019
Thermal aging reliability of socketable, surface-modified solder BGAs with and without polymer collars
Omkar Gupte , Gregorio Murtagian , Rao Tummala , Vanessa Smet
electronic components and technology conference
2020
Smooth, All-Solid, Low-Hysteresis, Omniphobic Surfaces with Enhanced Mechanical Durability.
Mathew Boban , Kevin Golovin , Brian Tobelmann , Omkar Gupte
ACS Applied Materials & Interfaces 10 ( 14) 11406 -11413
37
2018
Thermal Aging Reliability of Socketable BGA Packages With Ni–Au-Coated SAC305 Spheres
Omkar Gupte , Gregorio Murtagian , Rao Tummala , Vanessa Smet
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 ( 12) 2118 -2124
5
2020
Modeling and Design for System-Level Reliability and Warpage Mitigation of Large 2.5 D Glass BGA Packages
Vidya Jayaram , Omkar Gupte , Vanessa Smet
Smpte Journal 1060 -1067
1
2022
Investigation of Aromatic Voltage Stabilizers for Enhancing High Voltage Stability of Epoxy for Power Electronics
Jiaxiong Li , Kathaperumal Mohanalingam , Omkar Gupte , Zhijian Sun
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) 2348 -2354
2021
A review of low-temperature solders in microelectronics packaging
Vidya Jayaram , Omkar Gupte , Karan Bhangaonkar , Chandrasekharan Nair
IEEE Transactions on Components, Packaging and Manufacturing Technology 13 ( 4) 570 -579
9
2023
Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni–Au-Coated Cu Spheres
Omkar Gupte , Gregorio Murtagian , Rao Tummala , Vanessa Smet
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 ( 5) 828 -835
9
2019
Effect of latching force on socketed BGA packages with Ni-Au coated solder spheres
Omkar Gupte , Gregorio Murtagian , Rao Tummala , Vanessa Smet
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) 2158 -2164
3
2021
Solid-state diffusion studies of lead-free solders on gold and in polymer films
Omkar Gupte , Gregorio Murtagian , Mohanalingam Kathaperumal , Rao Tummala
Journal of Materials Science: Materials in Electronics 33 ( 10) 7679 -7690
2
2022
ELECTRONIC DEVICE CARRIER STRUCTURES INCLUDING POLYMER LAYERS AS BARRIERS TO SOLID STATE SOLDER DIFFUSION AND METHODS OF FORMING THE SAME
Omkar Gupte , Vanessa Smet , Gregorio R Murtagian
2022
Fundamentals of device and systems packaging: technologies and applications
Rao Tummala ,
McGraw Hill Professional
18
2019
Fundamentals of Device and Systems Packaging
Rao R Tummala ,
2019