引用次数
引用: 3,792
H-指数: 34
I10-指数 : 100
出版物: 184
Evaluation and Test Method Characterization for Mechanical and Electrical Properties in BGA Package
Yoon Jeong-Won , Koo Ja-Myeong , Jung Seung-Boo , Kim Dae-Gon
Journal of the Microelectronics and Packaging Society 12 ( 4) 289 -299
2005
Characteristics of conductive ink using octanethiolated copper nanoparticles produced via inert-gas condensation
M. G. Kwak , H. G. Yoon , J. W. Kim , Y. S. Kim
18th International Conference on Composites Materials, ICCM 2011
2011
Thermo-Mechanical Reliability of Lead-Free Surface Mount Assemblies for Auto-Mobile Application
Seung-Boo Jung , Won-Chul Moon , Jong-Hyuck Chae , Sang-Su Ha
Journal of Welding and Joining 24 ( 6) 21 -27
7
2006
Application of MEMS Technology in Microelectronic Packaging
Chang-Chae Shur , Seung-Boo Jung , Won-Chul Moon , Jeong-Hoon Moon
Journal of Welding and Joining 24 ( 2) 34 -41
2006
Recent Advances in Eco-friendly Nano-ink Technology for Display and Semiconductor Application
Jong-Woong Kim , Young-seok Kim , Jeong-No Lee , Nam-kee Kang
Journal of the Microelectronics and Packaging Society 17 ( 1) 33 -39
4
2010
Ultrasonic Bonding of Au Stud Flip Chip Bump on Flexible Printed Circuit Board
Pyoung-Woo Cheon , Seung-Boo Jung , Yu-Na Kim , Sang-Su Ha
Journal of the Microelectronics and Packaging Society 14 ( 4) 79 -85
2007
Fabrication of Through-hole Interconnect in Si Wafer for 3D Package
Seung-Boo Jung , Sang-Su Ha , Jae-Pil Jung , Jeong-Hoon Moon
Journal of Welding and Joining 24 ( 2) 64 -70
3
2006
Trends on Technology of Eco-friendly Metal and Ceramic Nanoparticle Inks for Direct Printing
Han Chul Jong , Kim， Young Sung , Hong Sung Jei , Tea-Whan Hong
Journal of the Microelectronics and Packaging Society 17 ( 2) 1 -9
2010
Recent Advances in Conductive Adhesives for Electronic Packaging Technology
Bo-In Noh , Seung-Boo Jung , Jong-Woong Kim , Jeong-Won Yoon
Journal of the Microelectronics and Packaging Society 16 ( 2) 1 -9
2009
Characteristics of High-Speed Shear Test Parameters for Brittle Interfacial Fracture of Solder Joint
Seung-Boo Jung , Young-Chul Lee , Jong-Woong Kim
한국표면공학회 학술발표회 초록집 368 -368
2008
Photo-induced healing of stretchable transparent electrodes based on thermoplastic polyurethane with embedded metallic nanowires
Kwang-Seok Kim , Su Bin Choi , Dae Up Kim , Cheul-Ro Lee
Journal of Materials Chemistry 6 ( 26) 12420 -12429
31
2018
Effect of Bonding Conditions on Conduction Behavior of Anisotropic Conductive Film Interconnection
Jong-Woong Kim , Young-Chul Lee , Seung-Boo Jung
Metals and Materials International 14 ( 3) 373 -379
6
2008
Pressure-sensitive strain sensor based on a single percolated Ag nanowire layer embedded in colorless polyimide
Chan-Jae Lee , Sungwoo Jun , Byeong-Kwon Ju , Jong-Woong Kim
Physica B-condensed Matter 514 8 -12
8
2017
Extremely rapid and simple healing of a transparent conductor based on Ag nanowires and polyurethane with a Diels–Alder network
Kyoung-hee Pyo , Da Hee Lee , Youngmin Kim , Jong-Woong Kim
Journal of Materials Chemistry C 4 ( 5) 972 -977
51
2016
Introduction of an Electroless-Plated Ni Diffusion Barrier in Cu/Sn/Cu Bonding Structures for 3D Integration
Byunghoon Lee , Haseok Jeon , Soonjae Kim , Kee-won Kwon
Journal of The Electrochemical Society 159 ( 2)
15
2011
Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application
Dae-Gon Kim , Jong-Woong Kim , Jung-Goo Lee , Hirotaro Mori
Journal of Alloys and Compounds 395 ( 1-2) 80 -87
28
2005
Thermally stable and flexible transparent heaters based on silver nanowire-colorless polyimide composite electrode
Kyoung-hee Pyo , Jong-Woong Kim
Current Applied Physics 16 ( 11) 1453 -1458
17
2016
Fabrication of substrate-free double-side emitting flexible device based on silver nanowire-polymer composite electrode
Sungwoo Jun , Byeong-Kwon Ju , Jong-Woong Kim
Current Applied Physics 17 ( 1) 6 -10
11
2017
Mechanical strength test method for solder ball joint in BGA package
Jong-Woong Kim , Dae-Gon Kim , Seung-Boo Jung
Metals and Materials International 11 ( 2) 121 -129
15
2005
Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF)
Jong-Bum Lee , Ja-Myeong Koo , Jong-Woong Kim , Bo-In Noh
Journal of Adhesion 85 ( 6) 341 -350
2009