Filled polymer compositions for mobile electronic devices
作者： Glenn P. Desio , Geert J. Verfaillie
DOI:
关键词: Glass fiber 、 Elastic modulus 、 Cross section (physics) 、 Polymer 、 Polymer composition 、 Composite material 、 Materials science 、 Electronics
摘要: The present invention relates to a polymer composition (C) comprising at least 20 wt % of one polymer, and glass fibers having non-circular cross section an elastic modulus 76 GPa. features outstanding balance mechanical processing performances which make them very well suited for the manufacture thin parts such as mobile electronic devices.
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