Magnetron sputtering system

作者: Jeroen Franciscus Landsbergen , Jan Visser

DOI:

关键词: Penning trapOptoelectronicsSputteringSputter depositionAnalytical chemistryAuxiliary electrodeMaterials scienceCathodeElectronElectrodeAnode

摘要: A magnetron sputtering system comprising a chamber. Present within the chamber are flat cathode plate, an anode, which is cylindrical in one embodiment, and annular auxiliary electrode. The electrodes provided co-axially. In this embodiment anode extends axially from central area of surface plate. electrode circumferential electrically insulated During operation has negative potential relation to potential. Furthermore comprises receiving device for substrate be coated with plate material at position opposite parallel magnetic outside generating electron trap around surrounded by generates asymmetric field. enhances interception electrons trap.

参考文章(6)
Allen J. Bourez, Brij B. Lal, Atef H. Eltoukhy, Magnetron sputter gun target assembly with distributed magnetic field ,(1991)
Jaroslav Zejda, Manfred Schuhmacher, Cathode sputtering system ,(1989)
Gary Evan Thomas, Jan Visser, Jacobus Eduardus Crombeen, Magnetron cathode sputtering system ,(1983)
Richard P. Welty, Magnetron sputtering cathode ,(1988)