Patterning substrates employing multiple chucks
作者： Byung-Jin Choi , Sidlgata V. Sreenivasan
DOI:
关键词: Optoelectronics 、 Substrate (printing) 、 Process conditions 、 Lithography 、 Materials science 、 Engineering drawing 、 Mold 、 Spatial relationship
摘要: The present Invention is directed towards a method for patterning first and second substrates in nanoimprlnt lithography system, the including, inter alia, concurrently positioning substrate on chuck; nanoimprint material substrate; removing from chuck while obtaining spatial relationship between mold assembly imprinting pattern with assembly; separating substrate, being subjected to substantially same process conditions.
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