作者: Pyshar Yi
DOI:
关键词: Integrated circuit 、 Nanotechnology 、 Transistor 、 Electronic systems 、 Nanoparticle 、 Materials science 、 Thermal 、 Heat transfer enhancement 、 Microfluidics
摘要: Ever more packing of transistors into integrated circuits (ICs), in order to achieve higher processing powers, signifies the problem cooling hot spots, which are generated during operation these electronic systems. Without any proper thermal