On the Extension of Processing Time with Increase in Temperature during Transient-Liquid Phase Bonding
作者： M.M. Abdelfatah , O.A. Ojo
DOI: 10.1007/S11661-008-9726-8
关键词: Materials science 、 Critical value 、 Transient (oscillation) 、 Computer simulation 、 Thermodynamics 、 Solubility 、 Structural material 、 Nickel 、 Phase (matter) 、 Superalloy
摘要: Transient-liquid phase (TLP) bonding of a nickel-based superalloy, IN 738, was performed. Contrary to conventional TLP analytical models, which assume parabolic relationship between liquid/solid interface migration and holding time, deviation from this law observed experimentally by numerical simulation. The deviation, is caused reduction in solute concentration gradient below critical value, suggested as an alternate phenomenon responsible for anomalous extension processing time required produce eutectic-free joint with increase temperature. A decrease the filler gap size use melting-point depressant (MPD) higher solubility base material could reduce occurrence behavior during high-temperature joining process.
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