Thin bond-line silicone adhesive
作者： Hong Zhong , Jennifer David
DOI:
关键词: Thermal 、 Materials science 、 Silicone adhesive 、 Polymer 、 Particle size 、 Bond line 、 Filler (packaging) 、 Composite material
摘要: Thermal interface compositions contain filler particles possessing a maximum particle size less than 25 microns in diameter blended with polymer matrix. Such enable lower attainable bond line thickness, which decreases in-situ thermal resistances that exist between materials and the corresponding mating surfaces.
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