Electroless copper deposition process having faster plating rates

摘要: There is provided a method for increasing the useful effective plating rate of an electroless copper deposition solution which comprises ion, complexing agent reducing and pH adjustor characterized by first increases passes through peak then decreases as function above 10. In accordance with this invention, such may be significantly increased operation thereof in presence accelerating or depolarizing at to achieve without same pH. The agents use herein include compounds containing delocalized pi-bond, heterocyclic aromatic nitrogen sulfur compounds, non-aromatic having least one amines.