Reliable aluminum contact formation by electrostatic bonding
作者： T Kárpáti , A E Pap , Gy Radnóczi , B Beke , I Bársony
DOI: 10.1088/0960-1317/25/7/075009
关键词: Intermetallic 、 Thermocompression bonding 、 Nanotechnology 、 Wafer bonding 、 Materials science 、 Fabrication 、 Wire bonding 、 Microelectromechanical systems 、 Composite material 、 Electrical contacts 、 Anodic bonding
摘要: The paper presents a detailed study of reliable method developed for aluminum fusion wafer bonding assisted by the electrostatic force evolving during anodic process. IC-compatible procedure described allows parallel formation electrical and mechanical contacts, facilitating packaging electromechanical systems with backside contacts. This supports fabrication complex microelectromechanical (MEMS) micro-opto-electromechanical (MOEMS) structures enhanced temperature stability, which is crucial in sensor applications such as pressure or sensors. Due to applied potential −1000 V Al metal layers are compressed force, at 450 °C intermetallic diffusion causes ions migrate between layers.
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