Greater Than the Sum of Its Parts
作者： Ning Yang , Christophe Caloz , Ke Wu
关键词: Electronics 、 Package on package 、 System on a chip 、 Electronic component 、 Engineering 、 Electronic engineering 、 System in package 、 Interface (computing) 、 Dual in-line package 、 Electronic circuit
摘要: Most RF systems are based on a self-design approach, in which the components conceived independently from one another, budget specifications and following pre-assigned common 50-? impedance interface. This approach requires design of separate with their own shielding package, related size constraints, terminals. When these then combined system assembling, they require many interconnecting matching transition circuits.
sci-hub.se 参考文章(20)
M. Engels, P. Wambacq, Stéphane Donnay, I. Bolsens, Single-chip versus single-package radios International conference on high density packaging and MCMs. ,vol. 3830, pp. 220- 225 ,(1999)
P.-C. Hsu, C. Nguyen, M. Kintis, Uniplanar broad-band push-pull FET amplifiers IEEE Transactions on Microwave Theory and Techniques. ,vol. 45, pp. 2150- 2152 ,(1997) , 10.1109/22.643753
A.C. Cangellaris, Electrical modeling and simulation challenges in chip-package codesign IEEE Micro. ,vol. 18, pp. 50- 59 ,(1998) , 10.1109/40.710871
A.M. Pavio, M.A. Smith, A 20--40-GHz Push--Push Dielectric Resonator Oscillator IEEE Transactions on Microwave Theory and Techniques. ,vol. 33, pp. 1346- 1349 ,(1985) , 10.1109/TMTT.1985.1133224
G. Troster, New Route In System Integration: Chip-Package Codesign IEEE Micro. ,vol. 18, pp. 7- 9 ,(1998) , 10.1109/MM.1998.710865
B. Gilbert, A precise four-quadrant multiplier with subnanosecond response IEEE Journal of Solid-state Circuits. ,vol. 3, pp. 365- 373 ,(1968) , 10.1109/JSSC.1968.1049925
G. Carchon, K. Vaesen, S. Brebels, W. De Raedt, E. Beyne, B. Nauwelaers, Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits IEEE Transactions on Components and Packaging Technologies. ,vol. 24, pp. 510- 519 ,(2001) , 10.1109/6144.946500
O. Casas, R. Pallas-Areny, Basics of analog differential filters IEEE Transactions on Instrumentation and Measurement. ,vol. 45, pp. 275- 279 ,(1996) , 10.1109/19.481347
R.A. Flynt, Lu Fan, J.A. Navarro, Kai Chang, Low cost and compact active integrated antenna transceiver for system applications international microwave symposium. ,vol. 44, pp. 1642- 1649 ,(1995) , 10.1109/22.538955
V. Radisic, Siou Teck Chew, Yongxi Qian, T. Itoh, High-efficiency power amplifier integrated with antenna IEEE Microwave and Guided Wave Letters. ,vol. 7, pp. 39- 41 ,(1997) , 10.1109/75.553052