Ion track enabled multiple wire microvia interconnects in printed circuit boards

摘要: Abstract As the call for higher wiring density in packaging and vertical microvia interconnections (microvias) rapidly evolves, need smaller lateral dimensions printed circuit boards (PCB) microvias must be met. The ion track lithography described this paper allows high throughput micromachining of small, deep, flexible PCB all-polymer laminates. Ion makes use swift heavy irradiation to enhance selectivity directionality chemical etching. Within areas exposed irradiation, small sub-micron pores (capillaries) are created, one every ion. If etching is prolonged, become merged. Electrodeposition from a metallic seed layer used fill these structures with metal. masks define either where tracks developed or metallized. smallest achievable size only limited by resolution mask; below 10 μm diameter can also achieved thick polyimide foils. Since each impinging forms track, foil’s porosity controlled adjusting dose, as well suitable size. Depending on material, resultant metallized consists individual interlaced wires (like strands bundle wire), solid. an wire may have aspect ratio several hundreds, fabrication truly structures, allowing ultra-high batch production. Demonstrator microstructures highly been fabricated foils up 125 μm thickness. Several components integrated presented us, e.g. magnetoresistive sensors, thermopile IR-sensors microwave like inductor elements.