Reduced formation of asperities in contact micro-structures

摘要: A device comprising movable micro-structures configured to contact a substrate is disclosed. The has metal-insulator-metal construction with an upper metal layer and insulator being patterned provide regions lower layer. have under layers for providing ribbon non-contact regions. In use, bias voltage applied across the top of causing through During contact, are maintained at potential that substantially less than voltage, thereby reducing formation asperities and/or sticking between contacting parts. preferably structures in optical MEM modulate light.