Die paddle clamping method for wire bond enhancement
作者： David J. Corisis
DOI:
关键词: Wire bonding 、 Structural engineering 、 Clamp 、 Paddle 、 Materials science 、 Clamping 、 Die (manufacturing) 、 Composite material
摘要: A leadframe configuration for a semiconductor device has die attach paddle with support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the to underlie conventional lead clamp. The are formed as an integral part paddle. Normal clamping during and wire bonding operations prevents movement enhances integrity bond bonds.
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