作者: Michael C. Doogue , Eric Burdette , Ravi Vig , P. Karl Scheller , Andreas P. Friedrich
DOI:
关键词: Composite material 、 Materials science 、 Die (integrated circuit) 、 Central region 、 Engineering drawing 、 Magnetic field 、 Ferromagnetism 、 Lead frame 、 Integrated circuit 、 Mold 、 Electromagnetic coil
摘要: A magnetic field sensor includes a lead frame, semiconductor die having first surface in which sensing element is disposed and second attached to the non-conductive mold material enclosing at least portion of frame. The may include ferromagnetic secured material. Features multi-sloped taper an inner non-contiguous central region material, separately formed region, one or more slots molded suppression device spaced from lead, passive coupled plurality leads, bead lead. Also described coil two separated portions with component across portions.