Thermal ratcheting of solder-bonded elastic and elastoplastic layers
作者： Kazuhiko Nakane , Nobutada Ohno , Masatoshi Tsuda , Yuji Yagi , Ikuo Nakagawa
DOI: 10.1016/J.IJPLAS.2007.12.008
关键词: Deflection (engineering) 、 Soldering 、 Power law 、 Materials science 、 Viscoplasticity 、 Composite material 、 Structural engineering 、 Finite element method 、 Constitutive equation 、 Temperature cycling 、 Hardening (metallurgy)
摘要: Abstract The cyclically growing deflection of solder-bonded elastic and elastoplastic layers subjected to cyclic thermal loading is studied. Finite element analysis a Si/Sn–95Pb/OFHC-Cu layered structure performed by taking into account the temperature-dependent viscoplastic behavior Sn–95Pb as well uniaxial ratcheting OFHC-Cu. A power law employed for viscoplasticity Sn–95Pb, while combined nonlinear kinematic isotropic hardening model assumed plasticity It shown that OFHC-Cu are controlling factors growth under temperature cycling. also plays an important role deflection, stress in Si layer develops noticeably if significant.
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