Method of fabricating a heat exchanger for solid-state electronic devices
作者： James A. Matthews
DOI:
关键词: Semiconductor 、 Heat exchanger 、 Coolant 、 Lamination 、 Integrated circuit 、 Composite material 、 Electronic engineering 、 Materials science 、 Solid-state 、 Electronics 、 Block (telecommunications)
摘要: A microscopic laminar-flow heat exchanger, well-suited for cooling a generating device such as semiconductor integrated circuit, includes plurality of thin plates, laminated together to form block. Each plate has recessed portion etched into one face the and pair holes cut through that when block is formed, align coolant distribution manifolds. The manifolds are connected via channels formed from portions during lamination process. Coolant flow these effectuates removal.
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