Substrate structure and electronic device
作者： Kazunori c , Haruo c , o Matsushita Electric In. Co. Ltd Kouno , o Matsushita Electric In. Co. Ltd. Hayakawa , o Matsushita Electric In. Co. Ltd. Konishi
DOI:
关键词: Terminal (electronics) 、 Substrate (printing) 、 Structural engineering 、 Materials science 、 Composite material
摘要: Provided is a substrate structure capable of reducing the size and thickness mobile terminal case. The (10) includes (11), plurality electronic parts (12) mounted along one mounting surface (11A) resin portion (13) covering with (13A) bonded to (11). has through hole (14) penetrating (11) in direction. side closed by cover member (15). A rise (21) arranged at periphery
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