Chip-on-chip connection with second chip located in rectangular open window hole in printed circuit board
作者： Mou-Shiung Lin , Bryan Peng
DOI:
关键词: Soldering 、 Electronic engineering 、 Optoelectronics 、 Connection (vector bundle) 、 Printed circuit board 、 Semiconductor 、 Engineering 、 Flip chip 、 Chip 、 Decoupling capacitor 、 Window (computing)
摘要: A chip package for semiconductor chips is provided by the method of forming a includes steps printed circuit board with window therethrough; connections one or more primary which overlie to solder connections, locating suspended within window, and connecting overlying in chip-on-chip connection. bypass capacitor formed on board.
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