Process for making contact with and housing integrated circuits
作者： Florian Bieck , Jeurgen Leib
DOI:
关键词: Electrical contacts 、 Terminal (electronics) 、 Connection (vector bundle) 、 Substrate (printing) 、 Integrated circuit 、 Engineering drawing 、 Geometry 、 Process (computing) 、 Surface (mathematics) 、 Engineering
摘要: A process for producing electrical contact connections a component integrated in substrate material is provided, the having first surface region, and at least one terminal being arranged partially region each component, which distinguished particular by application of covering to production passage which, material, runs transversely with respect process, order form location second be connection from contacts produced via respective passages.
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