Method of making thin film laminate printed circuit

摘要: Method of making a multilayer printed circuit including one or more thin film laminates having etched thereon without tearing, bending, wrinkling the laminate during fabrication and which allows use standard etching registration processes. The method involves application low melting point plastic adhesive to temporary backing for adhering registration. A high is then used an inner layer assembly laminate/temporary removed by heating adhesive. can be make circuits blasting cap initiating explosion secondary explosive.