Bimodally dispersed silver paste for the metallization of a crystalline silicon solar cell using electrohydrodynamic jet printing

摘要: Abstract Conventional silver paste for crystalline silicon solar cells exhibits low cell efficiency when deposited by non-contact electrohydrodynamic jet printing because of either high volumetric shrinkage or packing density there is no pressure applied to the paste. Therefore, we develop bimodally dispersed resolve both and conventional paste, its electrical rheological traits are investigated. The lower unit-line resistance, which inversely proportional weight ratio small-to-large particles due increased density, higher contact resistivity above a certain particles. This behaviour results from obstructed melt flow glass frit early coarsened densified small at an elevated temperature. also raises viscosity point where possible. By employing binary solvent mixture metallorganic as reducing agent, tuned printing, front-side metallization polycrystalline with emitter sheet resistance 60 Ω/sq constructed. With abnormally aspect electrodes 0.86, 16.72% achieved, than that screen-printed similar +0.22–0.52%p.