Aqueous cleaner for removing solder pastes

作者: Francis R. Cala , Eric E. Eichhorn , Richard A. Reynolds

DOI:

关键词: MetalSalt (chemistry)Aqueous solutionAlkali metalSolderingCorrosion inhibitorMaterials sciencePulmonary surfactantSolder pasteMetallurgy

摘要: Printing applicators such as metal stencils and screens used to apply solder paste printed circuit boards are cleaned remove accumulated therefrom by an aqueous alkaline salt cleaner. The cleaner of the present invention comprises salts alkali carbonates, a surfactant formulation which contains at least one nonionic surfactant, silicate corrosion inhibitor stabilizers maintain components in solution. no VOCs is effective safe replacement for alcohol solvents previously clean from stencils.

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