Touch screen assemblies for electronic devices
作者： Timothy James Orsley
DOI:
关键词: Flat glass 、 Thermal expansion 、 Electronics 、 Frit 、 Seal (mechanical) 、 Oxide 、 Composite material 、 Thin-film transistor 、 Backplane 、 Materials science
摘要: In one embodiment, a touch screen assembly includes sealing glass comprising ion-exchange strengthened having first coefficient of thermal expansion CTE1. The may also include backplane ion-exchangeable device surface, an underside and second CTE2, wherein CTE2 is within +/−15.0×10−7/° C. surface the bonded hermetically sealed to with frit seal which encloses area between glass. An array metal oxide thin film transistors be deposited on in area, have third CTE3 that CTE2.
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