Pick and place head construction

摘要: Disclosed is an improved pick and place head construction of a type employed for transporting individual semi-conductor chips similar articles manufacture during manufacturing processes, non-manufacturing environments. The disclosed device includes dual engaging the as well structure varying space between heads by means programmable actuators. In one embodiment, vacuum spindles which reciprocate axially to engage are also capable axial rotation enable engaged be rotated they transported location. Also article members formed synthetic resinous foam materials effective engagement non-planar surfaces. One form provides simultaneous static dissipation.