Product and process for bonding porous materials to substrates
作者： Karl Littau , Steven Buhler
DOI:
关键词: Piezoelectricity 、 Curing (chemistry) 、 Porous medium 、 Porosity 、 Materials science 、 Composite material 、 Adhesive
摘要: A product and process for bonding porous materials, such as piezoelectric to substantially non-porous substrates is described. The substrate contains a plurality of apertures extending through the surface. Adhesive dispensed on at least partially fill apertures. material then pressed against surface combination cured. During curing, portion adhesive absorbed into from apertures, however, sufficient remains in bond substrate.
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