Device with segmented ball limiting metallurgy
作者： Krishna Seshan
DOI:
关键词: Limiting 、 Electrical engineering 、 Engineering 、 Ball (bearing) 、 Process (computing)
摘要: The present invention discloses a novel layout and process for device with segmented BLM the I/Os. In first embodiment, each is split into two segments. segments are close to other connected same overlying bump. second more than third segment electrically one underlying via. fourth bond pad.
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