Hot pressing ceramic sheets for electronic substrates and for multilayer ceramic electronic substrates.
作者： Christian Bent Lundsager , John Wing-Keung Lau , Roy Warren Rice , Jack Harrison Enloe
DOI:
关键词: Metal 、 Ceramic 、 Substrate (electronics) 、 Layer (electronics) 、 Hot pressing 、 Materials science 、 Aluminium nitride 、 Composite material
摘要: A dense multilayer aluminium nitride electronic substrate is described which comprises a ceramic, internal metal circuitry on an layer and metal-containing vias connecting the to surface of ceramic.
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