Effect of electroplated interlayers on bonding mechanism of cold-sprayed copper on SS316L steel substrate
作者： Surinder Singh , Harpreet Singh
DOI: 10.1016/J.VACUUM.2019.109092
关键词: Copper 、 Electroplating 、 Nickel 、 Scanning electron microscope 、 Adhesion 、 Energy-dispersive X-ray spectroscopy 、 Paint adhesion testing 、 Composite material 、 Substrate (chemistry) 、 Materials science
摘要: … prior to cold-spraying, are very limited [16,34]. Therefore, in the present research, interlayers of … for the cold-sprayed copper has been investigated. However, the effect of electroplated …
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