Multi-Direction Design for Bump Pad Structures
作者： Tzuan-Horng Liu , Chih-Hua Chen , Chen-Cheng Kuo , Chen-Shien Chen
DOI:
关键词: Semiconductor chip 、 Electronic engineering 、 Integrated circuit 、 Engineering 、 Dielectric layer 、 Cable gland 、 Optoelectronics
摘要: An integrated circuit structure includes a semiconductor chip having first region and second region; dielectric layer formed on the of chip; elongated under-bump metallization (UBM) connector in longer axis extending direction; UBM direction. The direction is different from
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