Chip-scale packaged pressure sensor
作者： Sean S. Cahill , David W. Burns , Steven S. Nasiri , Janusz Bryzek
DOI:
关键词: Integrated circuit 、 Optoelectronics 、 Materials science 、 Semiconductor 、 Stress (mechanics) 、 Semiconductor device 、 Pressure sensor 、 Chip
摘要: A chip-scale sensor package is described. In one embodiment, the includes a semiconductor substrate having region, and cap recess. The bonded to with thermocompression bond form cavity therebetween. using different types of materials. and/or may optionally include device such as an electronically trimmable integrated circuit fabricated thereon. addition, integral stress isolation flexible region for region.
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