Method of manufacturing a chip card, and chip card thus produced

作者: Manfred Rietzler , David Finn

DOI:

关键词: Smart cardComputer hardwareContact surfacesElectromagnetic coilTransponderEngineeringFlip chipChipElectrical engineeringSubstrate (printing)

摘要: The invention concerns a method of manufacturing transponder unit (55), in particular chip card (17), including at least one (16) and coil (18), the being located on common substrate (15) formed by laying wire (21) joining ends (19, 23) to contact surfaces (20, 24) chip.