作者: Manfred Rietzler , David Finn
DOI:
关键词: Smart card 、 Computer hardware 、 Contact surfaces 、 Electromagnetic coil 、 Transponder 、 Engineering 、 Flip chip 、 Chip 、 Electrical engineering 、 Substrate (printing)
摘要: The invention concerns a method of manufacturing transponder unit (55), in particular chip card (17), including at least one (16) and coil (18), the being located on common substrate (15) formed by laying wire (21) joining ends (19, 23) to contact surfaces (20, 24) chip.