Kinematic simulation of high-performance grinding for analysis of chip parameters of single grains
作者： J.C. Aurich , B. Kirsch
DOI: 10.1016/J.CIRPJ.2012.07.004
关键词: Kinematics 、 Grinding 、 Mechanical engineering 、 Engineering 、 Chip 、 Level of detail 、 Grinding process 、 Process (computing) 、 Material removal 、 Grinding wheel
摘要: … undeformed chip thickness (h cu ), chip length (l cu ), chip width (b cu ) and … aspect ratio of the simulated chips (ratio of chip width to chip height) is 144, with 89.35% of the aspect ratios …
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