作者: Marcus Paulo Raele , Lucas Ramos De Pretto , Denise Maria Zezell
DOI: 10.1016/J.WASMAN.2017.07.019
关键词: Coating 、 Soldering 、 Printed circuit board 、 Electronic waste 、 Far-infrared laser 、 Laser 、 Waste management 、 Stripping (fiber) 、 Engineering 、 Process engineering 、 Environmentally friendly
摘要: Management of waste electric and electronic equipment (WEEE) is a key issue for modern societies; furthermore, it contains valuable materials that can be recycled, especially in printed circuit boards (PCB), which have approximately one-third their weight copper. In this study we demonstrated the use laser to strip covering soldering mask on PCB's, thus exposing copper underneath so extraction techniques may take place. Using Q-Switched Nd:YAG operating at 1064nm 532nm tested procedure under different energy conditions. The stripping was achieved with satisfactory results by irradiation 225mJ 1064nm. However, when using similar parameters process coating ejection not promoted properly, leading faulty detachment. Infrared PCB presents itself technically viable environmental friendly, since uses no chemicals inputs, offering one more option WEEE treatment recycling.