Semiconductor device using anisotropic conductive adhesive layer and manufacturing method thereof
作者： Futang Chu , Zhiqian Cheng , Mingyu Huang
DOI:
关键词: Semiconductor device 、 Electrical conductor 、 Chip 、 Active surface 、 Materials science 、 Anisotropic conductive adhesive 、 Composite material 、 Substrate (printing) 、 Semiconductor 、 Layer (electronics)
摘要: A semiconductor apparatus include a chip, substrate and an anisotropic conductive resin layer. The chip includes active surface, several mats protection layer, wherein the mat is configured at layer covers defines openings to exposure mat, so electric connection point with opening shape formed. surface mats, projects corresponding respectively. between electrically connected directly.
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