Wrap-around device
作者： Kenneth B. Pithouse
DOI:
关键词: Substrate (printing) 、 Lap joint 、 Closure (container) 、 Materials science 、 Wrap around 、 Abutment (dentistry) 、 Adhesive 、 Composite material
摘要: A wrap-around device for enclosing at least part of an elongate substrate such as a pipe comprises dimensionally-recoverable cover, preferably dimensionally heat-recoverable having adhesive closure arrangement comprising two portions which can be brought into abutment to form bond but which, when pulled in direction away from each other after the has been formed, will change configuration lap joint. The according invention enables installed about simple manner without possibility misalignment portions.
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