Heat exchanger assembly and method for making the same
作者： Joseph P. Mennucci , Charles R. Mead
DOI:
关键词: Direct bonding 、 Copper 、 Metallurgy 、 Beryllium oxide 、 Materials science 、 Base (geometry) 、 Block structure 、 Heat exchanger 、 Layer (electronics) 、 Fin
摘要: A heat exchanger assembly, having a first oxygen-rich copper base layer joined to of beryllium oxide, the oxide layer, second and structure direct bonded layer. The has plurality fins stacked upon one another, each fin channel at selected location therein. material interfaces between adjacent are another by bonding so as form solidified block structure. Each channels cooling chamber for receiving fluid flow.
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