Piping joint and semiconductor manufacturing apparatus
作者： Kenzo Kugimiya , Koudai Kitamura , Noriyuki Asami , Katsuhiko Tachibana , Nobuhide Yamada
DOI:
关键词: Electronic engineering 、 Joint (building) 、 Engineering 、 Line (electrical engineering) 、 Electrical conductor 、 Piping 、 Semiconductor device fabrication 、 Mechanical engineering
摘要: The piping joint according to the present embodiment includes a part that joins plurality of pipes for transporting medium one another. At least conductive line is provided between so as extend over cross-sections pipes. A ground grounds line. removes electric charges from via part.
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