Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification
作者： Xiaowu Hu , Wenjing Chen , Bin Wu
DOI: 10.1016/J.MSEA.2012.07.073
关键词: Microstructure 、 Composite material 、 Yield (engineering) 、 Materials science 、 Scanning electron microscope 、 Fiber 、 Optical microscope 、 Tensile testing 、 Ultimate tensile strength 、 Directional solidification 、 Mineralogy
摘要: Abstract Cu6Sn5 fiber reinforced Sn in situ composites with a nominal composition Sn–1Cu (wt%) were produced by specially controlled directional solidification using laboratory-scale Bridgman furnace equipped liquid metal cooling (LMC) device. The microstructure of as-produced was characterized optical microscopy (OM), electron (SEM) and microanalysis (EDX). tensile strength plasticity at room temperature examined tests. observation showed that the consisted β-Sn matrix fiber-like intermetallics compounds (IMCs). For constant gradient (12 Kmm−1), it found spacing between fibers diameter single crystalline mainly rate (V), both them decreased increasing rate. dominated alignment, such as diameter. Thus tests results have been correlated to (λ) (d), since growth has prevailed along all obtained samples. It ultimate (UTS) yield stress (YS) initially increased which ranged from 5 60 μms−1, further rate, 100 μms−1. In contrast, elongation (EL) due amount IMC quantity.
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