Tin whisker growth from micro-alloyed SAC solders in corrosive climate
作者： Balázs Illés , Barbara Horváth
DOI: 10.1016/J.JALLCOM.2014.07.103
关键词: Scanning electron microscope 、 Materials science 、 Field ion microscope 、 Whisker 、 Transmission electron microscopy 、 Monocrystalline whisker 、 Whiskers 、 Soldering 、 Focused ion beam 、 Metallurgy
摘要: Abstract In this paper the tin whisker growth properties of lead-free SAC (SnAgCu) solder alloys were investigated. There different studied: two micro-alloyed (SnAgCu + Bi + Sb) and widely applied SAC305 as reference. FR4 test board was developed for 0805 chip resistor components. Solder joints fabricated on imm-Sn surface finish. The samples aged in elevated temperature humidity levels to induce formation: at 85 °C/85RH% 85 °C/20RH%. duration 3000 h. Whisker checked after every 500 h by scanning electron microscope. whiskers etched focused ion beam cross-sections observed microscope transmission It shown that can also develop whiskering ability depends corrosion behavior solders. Copper bismuth precipitations found roots within which could effect number, length type whiskers.
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