Copper-based Graphene Nanoplatelet Composites as Interconnect for Power Electronics Pacakging

摘要: The present investigation demonstrates a singlestep electrodeposition route for the fabrication of compact copper-based graphene nanoplatelets (GnPs) nanocomposite coatings, with dispersed GnP co-deposition. effect cathodic current density on surface morphology deposits was examined. With increasing deposition densities from 10 to 40 mA/cm2, there seemed be gradual increase in lateral size co-deposited GnPs and decrease their distribution density, along progressive deposit feature. chemical state sub-surface region composite coatings assessed using XPS conjunction Ar ion sputtering found comparable that pristine GnPs. Cu-GnP exhibited slightly higher electrical sheet resistance, compared untreated Cu pure deposited counterparts.