S&P2 CWW1 connector with wipe

摘要: The present invention relates generally to interconnections between electronic devices, such as integrated circuit packages, chips, wafers, substrates or printed boards similar devices. more specifically springs equivalent means, used make connections electrical elements and applications of in connectors interconnection More particularly the means can be located adjacent each other on small effective center distances accommodate high-density Furthermore, combs that are conjunction with create control wiping scrubbing action, which promote good connection. Moreover, uses thermally matched devices improve performance during thermal cycling procedures.