Hybrid accelerometer assembly
作者： John A. Hearn , Dwight L. Schwarz , Glen R. Puterbaugh , William M. Maki
DOI:
关键词: Electrical engineering 、 Automotive safety 、 Substrate (printing) 、 Engineering 、 Wire bonding 、 Accelerometer 、 Vibrational resonance 、 Edge (geometry) 、 Acoustics 、 Electrical conductor
摘要: A microaccelerometer package is provided for use in on-board automotive safety control and navigational systems. The constructed so as to minimize the influence of extraneous mechanical stress vibrational resonance on micromachined accelerometer. includes a rigid housing which there cavity receiving accelerometer unit signal-processing circuitry. lower surface interrupted by recess projecting below plane surface. secured within be circuitry supported substrate cavity. One edge substrate, are disposed number wire bond sites, partially projects over recess, but no further than corresponding sites unit. Electrically interconnecting electrical conductors.
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