An effective heat propagation path-based online adaptive thermal model for IGBT modules
作者： Ze Wang , Wei Qiao , Bo Tian , Liyan Qu
DOI: 10.1109/APEC.2014.6803357
关键词: Junction temperature 、 Substrate (building) 、 Soldering 、 Thermal 、 Finite element method 、 Thermal resistance 、 Work (thermodynamics) 、 Mechanical engineering 、 Materials science 、 Insulated-gate bipolar transistor 、 Electronic engineering
摘要: The information of junction temperature is crucial for operation management IGBT modules. In practice, typically estimated by using an electrothermal model. modules are subject to various aging processes during operation, some which, e.g. substrate solder crack, changes the thermal impedance module. However, in literature little work has included effects into online behavior modeling This paper proposes Effective Heat Propagation Path (EHPP)-based adaptive model modules, where EHPP proposed quantify impact cracks on heat propagation inside A straightforward relationship between crack and degree nonuniformity case distribution established. Based EHPP, parameters a network, e.g., Cauer adjusted track caused cracks, leading validated comparing with finite element analysis (FEA) simulation results commercial
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