Heating plate and soldering method of IGBT (insulated gate bipolar transistor) module
作者： Cao Lin
DOI:
关键词: Base (geometry) 、 Reliability (semiconductor) 、 Column structure 、 Lamination 、 Composite material 、 Reflow soldering 、 Contact area 、 Soldering 、 Insulated-gate bipolar transistor 、 Materials science
摘要: The invention discloses a heating plate for soldering of an IGBT (insulated gate bipolar transistor) module and method the module. is designed to adopt column structure, during soldering, back bottom completely laminated with base and/or upper surface under effect gravity, can be adapted different pre-bending shapes plates, fully lamination arc-shaped in reflow process guaranteed, contact area increased, uniformity temperature void ratio decreased, reliability improved.
lens.org 参考文章(3)
Akira Kuibira, Masuhiro Natsuhara, Tomoyuki Awazu, Hirohiko Nakata, Heat transfer member, convex structural member, electronic apparatus, and electric product ,(2007)
Zhanguo Liu, Solar energy assembly laminator ,(2010)