作者: D.B. Boyer , K.C. Chan , J.W. Reinhardt
DOI: 10.1177/00220345840630101501
关键词: Interfacial bond 、 Materials science 、 Bond strength 、 Cohesive strength 、 Substrate (electronics) 、 Composite material 、 Layer (electronics) 、 General Dentistry
摘要: Interfacial bond strengths of light-activated composites were measured as a function age using transverse strength test. Bond between layers decreased with the initial layer and reflected setting curves composites. The highly-filled exhibited greatest strengths. Uncut surfaces provided better substrate for bonding than did ground surfaces. Use agent on both uncut improved Mean repair similar to those selfcuring Composites aged one wk had mean 27% cohesive without 48% agent.