Laser ablation of silicon in water under different flow rates

摘要: Underwater laser ablation is typically used to scribe a silicon wafer with low thermal damage and less redeposition of cut debris on the workpiece surface. However, hydrodynamic characteristics water some particles suspending in are able disturb beam during ablation. As such, overall cutting performance results can become poor or even unacceptable ablating conditions. This study thus aims at enhancing underwater process by controlling flow rate direction closed chamber setup. A single-crystalline selected as work sample this was grooved nanosecond pulse under different rates order carry excessive heat away from workpiece. According experimental findings, deeper groove be obtained when performed higher rate. By processing flowing water, significant disturbances air bubbles, waves, minimized, hence gaining better than still water. Furthermore, plastic deformation evident per presence slip bands surface, where band size found decrease increased